Basic Info.
Model NO.
JJBP-0121-0020
Usage
Blank Ceramic Circuit Board
Optional Color
White, Yellow, Black, Blue
Density
Over 6.0g/cm3
Flexural Strength
>800MPa
Dielectric Constant
33MHz
Dielectric Loss Angle
≦16MHz
Customized Service
OEM, ODM, Prototyping, Trial Order Supported
Transport Package
Individual Package
Specification
Standard or Customized
Trademark
JingHui
Origin
China
HS Code
8547100000
Packaging & Delivery
Package Size
36.00cm * 20.00cm * 24.00cm
Package Gross Weight
8.000kg
Product Description
Big Size Zirconia Circuit Board ZrO2 Wafer Zirconium Oxide Substrate
Introduction of Zirconia Ceramic Substrates
Molding Technique of Zirconia Ceramic Substrates
At present, injection molding, dry pressing and tape casting are usually used to pruduce zirconia ceramic substrates.
1. Injection molding is only suitable for forming thick substrates with thicknesses more than 1mm.
2. Dry pressing often causes delamination of the green body due to uneven radial and axial pressure distribution during the molding process.
3. Tape casting is suitable for producing thin ceramic substrates with thicknesses from 0.2mm to 3mm. The have the advantages of fast production
speed, high degree of automation, uniform structure and good product quality.
The molding process used for our zirconia ceramic substrates is tape casting. Below is the process flow.
Material Properties of Zirconia Ceramic Substrates
Why Choose Us?
The company has a strong processing capacity. We offer bare ceramic substrates in various raw materials, sizes, shapes and thicknesses. Contact
us today with your specifications.
Introduction of Zirconia Ceramic Substrates
Zirconia ceramics have high toughness, high flexural strength, high
wear resistance, excellent thermal insulation properties and the
thermal expansion coefficient close to that of steel.
Advantages of Zirconia ceramic substrates
1. Strong mechanical properties.
2. High temperature resistance.
3. Corrosion resistance.
4. Low thermal conductivity.
5. High insulation.
wear resistance, excellent thermal insulation properties and the
thermal expansion coefficient close to that of steel.
Advantages of Zirconia ceramic substrates
1. Strong mechanical properties.
2. High temperature resistance.
3. Corrosion resistance.
4. Low thermal conductivity.
5. High insulation.
Molding Technique of Zirconia Ceramic Substrates
At present, injection molding, dry pressing and tape casting are usually used to pruduce zirconia ceramic substrates.
1. Injection molding is only suitable for forming thick substrates with thicknesses more than 1mm.
2. Dry pressing often causes delamination of the green body due to uneven radial and axial pressure distribution during the molding process.
3. Tape casting is suitable for producing thin ceramic substrates with thicknesses from 0.2mm to 3mm. The have the advantages of fast production
speed, high degree of automation, uniform structure and good product quality.
The molding process used for our zirconia ceramic substrates is tape casting. Below is the process flow.
Material Properties of Zirconia Ceramic Substrates
| Zirconia Ceramic Substrate | ||
| Item | Unit | ZrO2 |
| Mechanical Properties | ||
| Color | / | White |
| Density | g/cm3 | ≥6 |
| Water Absorption | % | 0 |
| Vickers Hardness (Load 4.9N) | Gpa | 11 |
| Young's Modulus | GPa | 200 |
| Flexural Strength | Mpa | >800 |
| Fracture Toughness | MPa·m1/2 | 5.0 |
| Thermal Properties | ||
| Max. Service Temperature (Non-loading) | ºC | 1000 |
| CTE (Coefficient of Thermal Expansion) (20-800ºC) | 1×10-6/ºC | 7.8 |
| Thermal Shock Resistance | ≥10 Times | No Crack |
| Thermal Conductivity (25ºC) | W/m·K | >3 |
| Specific Heat (25ºC) | J/kg·K | 460 |
| Electrical Properties | ||
| Volume Resistivity (25ºC) | Ω·cm | ≥1013 |
| Dielectric Strength | KV/mm | ≥10 |
| Dielectric Constant (25ºC, 1MHz ) | (E) | 33 |
| Dielectric Loss Angle (25ºC, 1MHz ) | ×10-4 | ≤16 |
Why Choose Us?
The company has a strong processing capacity. We offer bare ceramic substrates in various raw materials, sizes, shapes and thicknesses. Contact
us today with your specifications.
